| |
2006-2008 Capability & Technology Roadmap |
|
| Manfacturing Capability |
2006 |
2007 |
2008 |
 Layer Count |
2-14 |
2-16 |
2-18 |
| Max.Panel Size |
23inx25in |
23inx25in |
23inx25in |
| Max.Board Thickness |
0.20in 5.00mm |
0.20in 5.00mm |
0.20in 5.00mm |
| Min.Core Thickness |
0.004in |
0.003in |
0.003in |
| Min.Copper Weight |
1/2oz |
1/2oz |
1/2oz |
| Max.Copper Weight |
4oz |
5oz |
5oz |
|
| F 2007/1/11 |
 |
| 2006-2008 Capability & Technology Roadmap |
|
| Manfacturing Capability |
2006 |
2007 |
2008 |
| Min. Outer Line Width |
0.004in |
0.003in |
0.003in |
| Min. Inner Line Width |
0.004in |
0.003in |
0.003in |
| Min. Outer Space |
0.004in |
0.003in |
0.003in |
| Min. Inner Space |
0.005in |
0.004in |
0.003in |
| Min. Space / edge to conductor |
0.010in |
0.010in |
0.009in |
|
| F 2007/1/11 |
|
| 2006-2008 Capability & Technology Roadmap |
|
| F 2007/1/11 |
